Thermal Interface Materials Experts and Supplier

AOK TP300 Compare with Bergquist Gap Pad® Gap Pad A3000/300s30

Polyester film supported, soft silicone-elastomer with thermal conductivity of 3.0 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties. Handles easily without crumbling.

SinoGuide TCP200 Compare with Bergquist Gap Pad® Gap Pad 2500s20/2500 

Thermally Conductive, Unreinforced Gap Filling Material, Gap Pad 2500s20/2500 Alternatives - TCP250 

High Performance,Thermally Conductive Gap Filling Material

Sinoguide TCP150 Compare with Bergquist Gap Pad® 1500

Thermally Conductive, Unreinforced Gap Filling Material

Features and Benefits
• Thermal conductivity: 1.5 W/m-K
• Unreinforced construction for additional
compliancy
• Conformable, low hardness
• Electrically isolating

SinoGuide^TM TCP100 Series Thermal Pad Compare with Bergquist Gap Pad^® HC1000

Highly Conformable, Thermally Conductive Material for Filling Air Gaps

“Gel-Like” Modulus Gap Filling Material