Thermal Interface Materials Experts and Supplier

 Alternatively referred to as heat dope, heat sink jelly, heat sink paste, heat sink compound, thermal gunk, and silicon compound, thermal compounds is a sticky paste that is placed directly onto the CPU, allowing for a more direct heat transfer between it and the heat sink. It also prevents air gaps from forming between the CPU and heat sink. The advantage of using a liquid dispensable Gap Filler is the ability to apply the material to very specific areas and at varying thicknesses, thus offering commercial and technical advantages.