SinoGuide TCP200 Compare with Bergquist Gap Pad® Gap Pad 2500s20/2500
Thermally Conductive, Unreinforced Gap Filling Material, Gap Pad 2500s20/2500 Alternatives - TCP250
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Monday, January 13, 2014
SinoGuide TCP250 Compare with Bergquist Gap Pad® 2500s20/2500
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Monday, December 23, 2013
SinoGuide TCP200 Compare with Bergquist Gap Pad 2000/2000S40
High Performance,Thermally Conductive Gap Filling Material
Typical Properties of TCP200 and Gap Pad® 2000/2000S40 Materials |
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Monday, December 23, 2013
SinoGuide TP150 Compare with Bergquist Gap Pad® 1500
Sinoguide TCP150 Compare with Bergquist Gap Pad® 1500
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits
• Thermal conductivity: 1.5 W/m-K
• Unreinforced construction for additional
compliancy
• Conformable, low hardness
• Electrically isolating
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Wednesday, December 11, 2013
SinoGuide TP100 Compare with Bergquist Gap Pad® HC1000
SinoGuideTM TCP100 Series Thermal Pad Compare with Bergquist Gap Pad® HC1000
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
“Gel-Like” Modulus Gap Filling Material
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Wednesday, December 11, 2013
SinoGuide TCP100U Series Thermal Pad Compare with Bergquist GAP PAD VO Soft
SinoGuide TCP100U Series Thermal Pad Compare with Bergquist Gap Pad® VO Ultra Soft
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
Typical Properties of TCP100U and GAP PAD VO ULTRA SOFT Materials |
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