AOK TP300 Compare with Bergquist Gap Pad® Gap Pad A3000/300s30
Polyester film supported, soft silicone-elastomer with thermal conductivity of 3.0 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties. Handles easily without crumbling.
SinoGuide TCP200 Compare with Bergquist Gap Pad® Gap Pad 2500s20/2500
Thermally Conductive, Unreinforced Gap Filling Material, Gap Pad 2500s20/2500 Alternatives - TCP250
High Performance,Thermally Conductive Gap Filling Material
Typical Properties of TCP200 and Gap Pad® 2000/2000S40 Materials |
Sinoguide TCP150 Compare with Bergquist Gap Pad® 1500
Thermally Conductive, Unreinforced Gap Filling Material
Features and Benefits
• Thermal conductivity: 1.5 W/m-K
• Unreinforced construction for additional
compliancy
• Conformable, low hardness
• Electrically isolating
When we talk about thermal pad, we will know that it's a pre-formed square or rectangle of solid material typically used with a central processing unit (CPU) and heatsink to create a better system of thermal conductivity.
Pad type of thermal material is often used instead of thermal paste since it is less messy than the paste and is sometimes included with a newly purchased heatsink rather than thermal paste. The thermal pad is typically less effective than thermal paste, however, so any computer user looking to overclock his or her CPU should consider using the paste rather than a pad.
A leading electronics services provider based in the China, SinoGuide, a developer of silicon-based technology, has introduced new SinoGuide dispensable thermal pads for use in LED, data server, telecommunications equipment and transportation thermal management applications.
SinoGuideTM TCP100 Series Thermal Pad Compare with Bergquist Gap Pad® HC1000
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
“Gel-Like” Modulus Gap Filling Material
SinoGuide TCP100U Series Thermal Pad Compare with Bergquist Gap Pad® VO Ultra Soft
Highly Conformable, Thermally Conductive Material for Filling Air Gaps
Typical Properties of TCP100U and GAP PAD VO ULTRA SOFT Materials |
SinoGuide TCP080 Series Thermal Pad Compare with The Bergquist Company GAP PAD VO
Conformable, Thermally Conductive Material for Filling Air Gaps
SinoGuide Thermal thermal materials deliver engineers and designers the most dimensional tolerance by conforming to surface irregularities and replacing air with a much higher thermal conductivity interface material; increasing the heat transfer and allowing the component to run cooler. Extreme compliancy reduces component stress while higher thermal conductivity provides thermal performance required for next generation designs that continue to pack more power into smaller spaces. The thermal materials like thermal pad for SinoGuide Thermal is used in many applications such as notebook computers, mass storage devices, and audio and video components.
