Effective thermal management remains key to ensuring consistent long-term performance and reliability in electronic devices. With an increasing variety of electronic applications demanding smaller packaging, higher power, and lower cost, the need for innovative high-performance thermal solutions, designed for ease of automation, continues to grow. Because of these new challenges, The pad versions of thermal interface materials are becoming more and more prevalent throughout the electronic markets. These include lowering levels of thermal resistance over traditional methods, ease of automation, and the ability of reducing part count within the assembly. All of which can result in overall cost savings.
The pad thermal interface materials were originally designed for the automotive industry and the need for use highly automated production lines. These materials have been used for over a decade in some of the most demanding electronic products on the market. Because of their success there, the demand for thermal interface pad materials is rapidly rising in all of the electronic industry, as they assist in reducing the overall cost of manufacturing while increasing the thermal performance of assemblies.
the primary form of thermal interface materials used in the electronic industry has been a sheeted product or thermal interface pad. The ease of handling these product types, along with high dielectric integrity, have made thermal interface pad solutions a standard in managing heat in electronic modules for the last few decades.
